System On Package

Autor: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
File Size: 20,97 MB
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Introduction To System On Package Sop

ISBN: 9780071603157
File Size: 10,44 MB
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.

Fundamentals Of Microsystems Packaging

Autor: Rao Tummala
Publisher: McGraw-Hill Education
ISBN: 9781259861550
File Size: 62,29 MB
Format: PDF, ePub, Mobi
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A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field

3d Microelectronic Packaging

Autor: Yan Li
Publisher: Springer
ISBN: 3319445863
File Size: 49,44 MB
Format: PDF, Docs
Read: 322
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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Fan Out Wafer Level Packaging

Autor: John H. Lau
Publisher: Springer
ISBN: 9811088845
File Size: 25,19 MB
Format: PDF, Mobi
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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Handbook Of Solid State Diffusion Volume 2

Autor: Aloke Paul
Publisher: Elsevier
ISBN: 0128045787
File Size: 27,99 MB
Format: PDF, Mobi
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Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications covers the basic fundamentals, techniques, applications, and latest developments in the area of solid-state diffusion, offering a pedagogical understanding for students, academicians, and development engineers. Both experimental techniques and computational methods find equal importance in the second of this two volume set. Volume 2 covers practical issues on diffusion phenomena in bulk, thin film, and in nanomaterials. Diffusion related problems and analysis of methods in industrial applications, such as electronic industry, high temperature materials, nuclear materials, and superconductor materials are discussed. Presents a handbook with a short mathematical background and detailed examples of concrete applications of the sophisticated methods of analysis Enables readers to learn the basic concepts of experimental approaches and the computational methods involved in solid-state diffusion Covers bulk, thin film, and nanomaterials Introduces the problems and analysis in important materials systems in various applications Collates contributions from academic and industrial problems from leading scientists involved in developing key concepts across the globe

Wafer Level Chip Scale Packaging

Autor: Shichun Qu
Publisher: Springer
ISBN: 1493915568
File Size: 10,31 MB
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Millimeter Wave Low Noise Amplifiers

Autor: Mladen Božanić
Publisher: Springer
ISBN: 3319690205
File Size: 58,23 MB
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This book examines the challenges of low-noise amplifier (LNA) research and design in the millimeter-wave regime by dissecting the common LNA configurations and typical specifications into parts, which are then optimized separately over several chapters to suggest improvements in the current designs. It provides extensive theoretical background information on both millimeter-wave operation and LNA operations, and then describes passive components that make these LNAs possible, as well as broadband configurations and optimization techniques. The book is intended for researchers, circuit designers and practicing engineers.

Miniaturization Of Analytical Systems

Autor: Angel Rios
Publisher: John Wiley and Sons
ISBN: 0470748109
File Size: 10,47 MB
Format: PDF, Kindle
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The book describes a general vision of the miniaturization of the analytical systems, including their principles, designs and applications. Through ten chapters the different aspects characterizing the miniaturized systems are developed. Thus, the two first chapters include the basic concepts behind miniaturization in analytical chemistry, as well as the mechanical and electronic tools needed for designing and fabricating miniaturized analytical systems. Chapters 3 to 6 represent the core of the book, as they take as the basis the analytical process and deal with the miniaturization of sample treatment (including the consequent automation), with sections devoted to the problems associated with sample introduction in micro(nano) systems; miniaturized systems for analyte separation, depending of the forces involved in moving the flow; and detection in micro-size environments. Following on, Chapters 7 and 8 will deal with the miniaturization of the entire process: from sample introduction to the generation of the corresponding analytical results. The last part of the book will deal with two aspects of miniaturized analytical systems directly connected to their usefulness: the design of portable miniaturized systems (interesting for performing field tests) and how to assure the practical reliability of the micro(nano) systems (quality control tests, performance and validation activities, as well as the robustness of the miniaturized depicted systems. The ruggedness of micro(nano) systems are briefly discussed and related to the tools for designing and fabricating described in the first chapters of the book.

Microsystems For Bioelectronics

Autor: Victor V. Zhirnov
Publisher: William Andrew
ISBN: 9781437778410
File Size: 74,48 MB
Format: PDF
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Microsystems for Bioelectronics is the ultimate guide in the biomedical application industry. It provides a physics-based assessment of the limitless potential of miniaturization technologies. This book goes far beyond the complete design of the final systems. It also discusses the developments of computation and communication subsystems. The future of this technology lies in understanding the scaling limits for the individual systems. This includes all of its components and the fundamental energy source that powers all autonomous microsystems. Rapid advances in microfabrication technologies are offering new opportunities and capabilities to develop systems for biomedical applications. These applications include the diagnostics community and those that are active in therapy services. Microsystems for Bioelectronics is one of the only books on the market today that goes into the comprehensive treatment of integrated microsystems. Discusses the diverse components that make up Microsystems Outlines the problems with miniaturization of energy sources Perfect reference for those in both the Engineering and Medical Profession